Apple's iPhone 8 will go on sale in October, following a launch event in September, with its suppliers having resolved issues with the device's internal components.

According to a report by the Economic Times, Apple's aggressive strategy is aimed to target the mid-range smartphone segment in the country which is largely dominated by Korean electronic giant Samsung and Chinese smartphone makers Oppo, Xiaomi, Gionee and Lenovo.

Early on Monday, a report online said that suppliers of laminate motherboards Kinsus Interconnect and Zhen Ding, had straightened out prior difficulties and now are ready to ratchet up production of parts for iPhones in June. "TSMC will begin to fabricate the wafer starts needed for the production of A11 processors on June 10 and to deliver the chips in volume quantity in the second half of July, the report indicated".

As for the firms which put iPhones together, Foxconn, Wistron and Pegatron seem to have accelerated the recruitment and training of new employees in anticipation of mass production for the new handset. The iPhone 8 is expected to be the first widely available smartphone to feature a fingerprint sensor under the display, a feature that would help Apple increase the phone's screen-to-body ratio without compromising on security features. Although he believes that this delay won't undermine the actual demand as long as the iPhone 8 lives up to the hype.

Incidentally, the iPhone 8 will also launch alongside two other iPhone models, the iPhone 7s and the iPhone 7s Plus.

According to White, iPhone 8, repatriation of foreign cash and new innovations could bring more good news for Apple shares. We saw the jet black with the iPhone 7. The new report debunks previous accounts that suggested that the tech titan was going to experience supply shortages. A third version, which could be known as the iPhone 8, is expected to come with a sizable update, including a new all-glass design. As per these rumours, Apple is planning to integrate the Touch ID sensor within the layers of OLED panel.